Post-Clean

Post-Clean

Pre_Clean

Observations/Conclusions
The post clean photos exhibit the lack of residual
flux, water or staining of surfaces. Solder bumps
are bright & free of discoloration with no
watermarks or spots visible after drying.

Application Description
Cleaning water soluble flux residue from Flip
Chip devices measuring approximately one
square inch, with a <1.0 mil offset and
approximately 1800 solder bumps. The
challenge was to clean flux residue from
under tight offsets of <1 mil with a dense
array of solder bumps. Devices also were
required to be dry at the end of the cleaning
process.



40mu offset, 1800 bumps, 1” x 1”
package

Clean, rinse & dry in-situ, < 20 min.